HumiSeal 1C49 is a moisture curing, high build, VOC-free silicone conformal coating which provides excellent moisture and environmental protection for printed circuit assemblies. HumiSeal® 1C49 is solvent free. The coating demonstrates outstanding flexibility, fluoresces under UV light for ease of inspection and can be repaired. HumiSeal® 1C49 can be cured at room or at elevated temperatures. HumiSeal® 1C49 is MIL-I-46058C qualified, IPC-CC-830 and RoHS Directive 2011/65/EC compliant, and recognized under UL File Number E105698.
Cleanliness of the substrate is of extreme importance for the successful application of a conformal coating. Surfaces must be free of moisture, dirt, wax, grease, flux residues and all other contaminants. Contamination under the coating could cause problems that may lead to assembly failures.
Uniformity of the film depends on component density and operator’s technique.
A controlled rate of immersion and withdrawal (5-15 cm/min) will ensure even deposition of the coating and ultimately a uniform film. Blanketing dip tanks with an inert gas such as nitrogen can extend pot life.
HumiSeal® 1C49 may be applied using spraying equipment designed for high viscosity coatings. Attempting to apply the material using conventional spray equipment may result in bubbles in the cured HumiSeal® 1C49 coating. When in doubt, test the ability of the spray equipment before applying coating to production boards. Spraying should be done in an environment with adequate ventilation so that the vapour and mist are carried away from the operator. The use of thinner is not required or recommended for HumiSeal® 1C49.
|Density, per ASTM D1475||0.97 ± 0.03 g/cm³|
|Min. Solids Content, % by weight per Fed-Std-141, Meth. 4044||95 %|
|Viscosity, per Fed-Std-141, Meth. 4287||9000 ± 1500 centipoise|
|Recommended Coating Thickness||50 – 200 microns|
|Drying Time to Handle per Fed-Std-141, Meth. 4061||3 – 5 hours|
|Recommended Curing Conditions||24 hrs @ RT or 20 min @ 76°C*|
|Time required to Reach Optimum Properties||7 days|
|Recommended Stripper||HumiSeal Stripper 1090|
|Shelf Life at Room Temperature, DOM||12 months|
|Thermal Shock, 50 cycles per MIL-I-46058C||-65°C to 200°C|
|Coefficient of Thermal Expansion – TMA||367 ppm /ºC|
|Glass Transition Temperature – DSC||< -65°C|
|Storage Modulus – DMA||408 MPa @ -40ºC|
1.6 MPa @ 25ºC
1.4 MPa @ 80ºC
|Tensile, per ASTM D412||30-50 psi|
|Elongation, per ASTM D412||80-120 %|
|Build per Dip, per ASTM D823||5 mils|
|Flammability, per UL94||V-1|
|Dielectric Withstand Voltage, per MIL-I-46058C||>1500 volts|
|Dielectric Breakdown Voltage, per ASTM D149||7000 volts|
|Dielectric Constant, at 1MHz and 25°C per ASTM D150-98||2.5|
|Dissipation Factor, at 1MHz and 25°C per ASTM D150-98||0.01|
|Insulation Resistance, per MIL-I-46058C||5.0 x 1014 ohms (500TΩ)|
|Moisture Insulation Resistance, per MIL-I-46058C||1.0 x 1010 ohms (10GΩ)|
|Fungus Resistance, per ASTM G21||Passes|
* Place an open pan of water in the oven during curing